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DIC Develops Phenolic Resin for Thick-Film Resists

Jan. 9, 2019

Filed Under: Innovation Tagged With: DIC, phenol resin, phenolic resin, phenolic resins, R&D, resist, resists, semiconductor packaging materials, semiconductors

DIC Corp. (TYO:4631) announced on Dec. 26, 2018 that it has developed the RZ-230 series of phenolic resin, targeting this…...

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