Japan Chemical Daily

Japan's leading chemical industry newspaper

Log In

AIST Codevelops New Bonding Technology for Use in 5G Circuit Boards

Filed Under: Innovation Tagged With: , , , , , , ,

The National Institute of Advanced Industrial Science and Technology (AIST) and Shizuoka Prefecture-based Advanced Technologies Inc. (ATI) recently announced that…...

Please subscribe to read the full story.

Subscribe Free Trial

Related Articles:

Toray Turns PPS Film Into Substrate for Flexible PCBs
Toray Turns PPS Film Into Substrate for Flexible PCBs
Flexible PCB Manufacturers See Potential in China’s Robotics Market
Flexible PCB Manufacturers See Potential in China’s Robotics…
Mitsubishi Chemical Develops 5G Film with Ultralow Dielectric Loss
Mitsubishi Chemical Develops 5G Film with Ultralow…
Daikin to Apply Fluorine Technology in Market for Printed Circuit Boards
Daikin to Apply Fluorine Technology in Market for Printed…
Mitsubishi Gas Chemical to Boost Production Capacity for PCB Materials by 20%
Mitsubishi Gas Chemical to Boost Production Capacity for PCB…
Sumitomo Bakelite Pursues Development of New Polymer for 5G Applications
Sumitomo Bakelite Pursues Development of New Polymer for 5G…