Kaneka’s Super-Heat-Resistant PI Film Set for Use in 5G Smartphone May. 8, 2019 Filed Under: Materials Tagged With: 5G, Fuji Chimera Research Institute, Kaneka, polyimide, smartphonesKaneka Corp. (TYO:4118) recently announced that its new Pixeo SR line of super-heat-resistant polyimide (PI) film has been adopted for…... Please subscribe to read the full story. Subscribe Free Trial Related Articles:Kaneka Eyes Increased Production of 5G-Compatible Polyimide…Mitsubishi Chemical Develops 5G Film with Ultralow…AGC Sees High-End Fluoropolymer Picked up for 5G Smartphones…Toray Turns PPS Film Into Substrate for Flexible PCBsUbe Industries Eyes Two-Pronged Strategy for Bolstering…Shin-Etsu Chemical to Launch Three New Product Lines for 5G…