Mitsubishi Chemical Corp. has developed a new epoxy resin that combines high heat resistance with low viscosity. Conventional production methods…...

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Filed Under: Innovation Tagged With: electronic materials, epoxy resin, heat resistance, low viscosity, Mitsubishi Chemical, molded underfill materials
Mitsubishi Chemical Corp. has developed a new epoxy resin that combines high heat resistance with low viscosity. Conventional production methods…...
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