Japan Chemical Daily

Japan's leading chemical industry newspaper

Log In

Toagosei Develops Adhesive Compatible With Injection Molding, Allowing Complex Parts to be Bonded in Single Step

Filed Under: Materials Tagged With: , , , , ,

Toagosei Co. Ltd. (TYO:4045) has developed an ultrathin film adhesive that can be shaped with injection molding. The new material…...

Please subscribe to read the full story.

Subscribe Free Trial

Related Articles:

Cemedine Develops Bonding Agent With Low Melting Point, Reduces Cost of LCD ManufactureCemedine Develops Bonding Agent With Low Melting…
Adeka Promotes Quick Bonding System for Auto PartsAdeka Promotes Quick Bonding System for Auto Parts
Daicel-Evonik Targets Auto Sector With Metal–Plastic Bonding TechnologyDaicel-Evonik Targets Auto Sector With Metal–Plastic…
Mitsubishi Chemical's New Adhesive Resin Bonds PP and PVC via Co-Extrusion MoldingMitsubishi Chemical's New Adhesive Resin Bonds PP…
Nippon Steel Nisshin Promotes Special Pla-Tight Steel Sheets for Direct Plastic BondingNippon Steel Nisshin Promotes Special Pla-Tight…
Fujimori Kogyo Looks to Cultivate Demand for Bonding Heterogeneous Materials With Hot Melt Adhesive FilmFujimori Kogyo Looks to Cultivate Demand for Bonding…

Send this to a friend