Japan Chemical Daily

Japan's leading chemical industry newspaper

Log In

Sekisui Chemical Develops Faster-Bonding Adhesive to Enable More Efficient Smartphone Assembly

Filed Under: Products Tagged With: , , , , , , ,

Sekisui Chemical Co. Ltd. (TYO:4204) has developed an adhesive capable of substantially reducing the time and labor required for smartphone…...

Please subscribe to read the full story.

Subscribe Free Trial

Related Articles:

Toagosei Develops Adhesive Compatible With Injection Molding, Allowing Complex Parts to be Bonded in Single Step
Toagosei Develops Adhesive Compatible With Injection…
Launch of iPhone 12 Set to Shake up Smartphone Components Sector
Launch of iPhone 12 Set to Shake up Smartphone…
Fujimori Kogyo Looks to Cultivate Demand for Bonding Heterogeneous Materials With Hot Melt Adhesive Film
Fujimori Kogyo Looks to Cultivate Demand for Bonding…
Sekisui Chemical Makes Push With Automotive Materials
Sekisui Chemical Makes Push With Automotive Materials
Mitsui Chemicals Develops New Adhesive Tape Without Use of an Adhesive
Mitsui Chemicals Develops New Adhesive Tape Without…
Fujifilm Looks to Enter Into New Realms With Display Materials
Fujifilm Looks to Enter Into New Realms With Display…