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BT Resin From Mitsubishi Gas Chemical Helps Make Semiconductor Packaging Lighter, Thinner and Smaller

Apr. 16, 2021

Filed Under: Materials Tagged With: Mitsubishi Gas Chemical, new materials, semiconductor materials, semiconductor packaging materials, semiconductors

Mitsubishi Gas Chemical Co. Inc. (MGC; TYO:4182) is working to open up new applications for its semiconductor packaging substrate materials…....

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Previous Post: « Packaging Sector Enters Era of Major Reform – Part 5: Recovering Raw Materials Without Quality Degradation
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