DIC Corp. (TYO:4631) is ramping up its global rollout of solvent-free oxygen barrier adhesives for use in monomaterial food packaging…....
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adhesives
Sekisui Chemical Develops Faster-Bonding Adhesive to Enable More Efficient Smartphone Assembly
Sekisui Chemical Co. Ltd. (TYO:4204) has developed an adhesive capable of substantially reducing the time and labor required for smartphone…...
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DIC Develops Dry Lamination Adhesive From Plastic Bottles
DIC Corp. (TYO:4631) recently announced that it has developed a dry lamination adhesive made from recycled polyethylene terephthalate (PET) bottles…....
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