Sekisui Chemical Co. Ltd. (TYO:4204) has developed an adhesive capable of substantially reducing the time and labor required for smartphone…...
bonding technology
Daicel Miraizu Develops New Technology to Forego Need for Molds in Joining Dissimilar Materials
Daicel Miraizu Ltd. has developed a novel technology for joining together dissimilar materials. The new method here incorporates the electromagnetic…...
Toagosei Develops Adhesive Compatible With Injection Molding, Allowing Complex Parts to be Bonded in Single Step
Toagosei Co. Ltd. (TYO:4045) has developed an ultrathin film adhesive that can be shaped with injection molding. The new material…...