Sekisui Chemical Co. Ltd. (TYO:4204) has developed an adhesive capable of substantially reducing the time and labor required for smartphone…...
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bonding technology
Daicel Miraizu Develops New Technology to Forego Need for Molds in Joining Dissimilar Materials
Daicel Miraizu Ltd. has developed a novel technology for joining together dissimilar materials. The new method here incorporates the electromagnetic…...
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Toagosei Develops Adhesive Compatible With Injection Molding, Allowing Complex Parts to be Bonded in Single Step
Toagosei Co. Ltd. (TYO:4045) has developed an ultrathin film adhesive that can be shaped with injection molding. The new material…...
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