Mitsubishi Gas Chemical Co. Inc. (MGC; TYO:4182) is working to open up new applications for its semiconductor packaging substrate materials…....
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semiconductor packaging materials
DIC Develops Phenolic Resin for Thick-Film Resists
DIC Corp. (TYO:4631) announced on Dec. 26, 2018 that it has developed the RZ-230 series of phenolic resin, targeting this…...
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In Good Shape: Japanese Semiconductor Packaging Makers Ride Strong Market Demand
The major suppliers of semiconductor packaging materials are anticipating strong sales again this year. Demand for these materials is growing,…...
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